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AI/HPC Accelerators
GPU pods, tensor ASICs, high‑bandwidth memory, and interconnects.
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Latest in AI/HPC Accelerators
Samsung Affiliates Plan $9.15 Billion Semiconductor Investment
1+ hour, 46+ min ago (308+ words) Samsung affiliates plan to invest a combined 12.26 trillion won (9.15 billion) in semiconductor operations in Vietnam and South Korea. About 8 trillion won (5.99 billion) is earmarked for Vietnam, while South Korea is to receive investment in high-end production capacity. The plans include…...
SK Hynix Tests Memory Chips in Orbit Aboard South Korean Satellite
8+ hour, 6+ min ago (517+ words) All of Asia. An independent newsroom covering the business, finance, technology and culture shaping the region, and the forces moving it next. The Korean chipmaker's DRAM and flash storage products entered space on the country's fifth Nuri rocket launch, opening…...
Samsung Electronics Takes On SK Hynix Head-On with Three-Pronged zNAND Lineup for AI Memory Market
4+ hour, 18+ min ago (546+ words) Samsung Electronics is developing its next-generation "zNAND" flash memory in three segmented product lines, according to industry sources. Following the on-device AI-focused "zNAND-O," the company is preparing "zNAND-T" for data centers and "zNAND-I" specialized for AI inference, positioning itself to…...
Samsung affiliates to invest $9.15 billion in semiconductor operations, with major focus on Vietnam
2+ hour, 31+ min ago (449+ words) Samsung affiliates plan to invest a combined 12.26 trillion won ($9.15 billion) in semiconductor operations, with nearly 8 trillion won ($5.99 billion) earmarked for Vietnam while expanding high-end production capacity in South Korea, The Korea Herald reported. According to the report, Samsung Electronics plans…...
Korea's Largest Chip Show Opens With AI Memory, Physical AI
4+ hour, 53+ min ago (293+ words) Held at COEX From the 14th to the 16th Samsung, SK and 300 Other Companies to Take Part SEDEX 2026, South Korea's largest semiconductor exhibition, opens on the 14th at COEX in Seoul. Samsung Electronics (005930.KS), SK hynix (000660.KS) and other domestic chipmakers will showcase…...
Samsung to expand chip capacity in Vietnam, boost high-end production in South Korea
4+ hour, 6+ min ago (432+ words) View all posts by Jie Ye-eun → SEOUL – Samsung affiliates plan to invest a combined 12.26 trillion won ($9.15 billion) in chip operations, directing nearly 8 trillion won to Vietnam while expanding high-end production capacity in South Korea. Samsung Electronics plans to invest 105.79 trillion…...
China at major risk of losing global memory chip, AI race
4+ hour, 44+ min ago (267+ words) Hong Kong, Aug 6 China may lag behind in the global memory chip and artificial intelligence (AI) race amid Beijing's restriction on US-based Micron Technology and export sanctions by Joe Biden administration on American companies on sharing tech with China, the…...
[News] AI Interposers Grow Larger, Raising HBM4E Cooling Challenges: How Samsung, SK hynix Are Responding
4+ hour, 36+ min ago (426+ words) As AI packages expand to accommodate more compute and memory, managing heat is becoming increasingly important for next-generation HBM. According to C... TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions....
Q3 global PC shipments plunge more than 20 percent, hit by AI-driven memory squeeze
5+ hour, 17+ min ago (305+ words) Global PC shipments fell more than 20 percent year-on-year in the third quarter, posting the steepest decline since the first quarter of 2023. Memory prices have surged as AI data centres expand. PC makers also built up inventory in advance, while consumers…...
Memory wall reshapes chip performance as large-capacity SRAM becomes a focal point in autonomous driving SoC design
5+ hour, 54+ min ago (194+ words) DIGITIMES observed that as AI computing has hit a bottleneck from the memory wall, data storage and data movement have become extensions of the computing task, also reshaping the role of memory vendors into co-design partners for integrated circuit (IC) design....