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Process & Lithography
Nodes, EUV tools, yield, and the push toward angstrom‑class manufacturing.
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Latest in Process & Lithography
Apodex 1.1 vs Apodex 1.1 Mini: Benchmarks & Cost
2+ day, 11+ hour ago (140+ words) Updated October 10, 2026. We do not rank this pair: at least one has no public score. Public scores include evidence status and uncertainty. This is a same-family comparison, so migration details appear when the source data supports them. Apodex 1.1 vs Apodex…...
Beyond Conventional Tolerances: Baucor Targets 2-Micron Blade Precision
18+ hour, 34+ min ago (114+ words) Engineering at the Micron Level: Baucor Advances Industrial Blade Performance With manufacturing tolerances reaching ±0.002 mm (±2 microns) on selected critical dimensions, surface finishes as fine as Ra 0.1 µm, and precisely engineered cutting geometries, Baucor manufactures cutting tools for applications where microscopic…...
Researchers work out how to control 2D semiconductor growth for future chips
2+ day, 3+ hour ago (719+ words) Korean boffins use oxygen to stop crystals forming in the wrong places, aiming to get tech to commercial sector by 2030 Researchers have demonstrated a way to control where 2D semiconductor crystals begin growing, potentially addressing an obstacle to manufacturing next-generation chips…...
Exploring Lithography Chip Making for Modern Chips
2+ day, 7+ hour ago (565+ words) Semiconductor lithography is at the center of today’s chip industry. The 70-year-old process has evolved tremendously since it was first introduced and now ensures modern silicon is more advanced than ever. Lathrop’s process replaced the bulky vacuum tubes and large…...
FAQ: How Much Do You Know About ASOs?
2+ day, 9+ hour ago (170+ words) BioPharm International connects biopharmaceutical professionals with scientific and business insights on biopharma R&D, manufacturing & regulatory issues. FAQ: How Much Do You Know About ASOs? Antisense oligonucleotides are reshaping drug design, from RNase H gapmers to inhaled delivery; this FAQ…...
ASML | New Civil Engineer
2+ day, 21+ hour ago (38+ words) ASML New Civil Engineer The Institution of Engineering and Technology (IET) has named four individuals as honorary fellows for 2026, recognising their contributions to humanitarian engineering, computer science, semiconductor innovation and the engineering profession. Walker Dendle Technical Recruitment...
ASML Pullback Could Be Part of a Larger Fourth-Wave Triangle
3+ day, 1+ hour ago (11+ words) Barchart.com...
Why Semiconductor Production is Getting Harder to Control
2+ day, 23+ hour ago (73+ words) News, voices and jobs for CIOs. Optimized for your mobile phone. Don't miss tomorrow's tech industry news Why Semiconductor Production is Getting Harder to Control Get the free newsletter Take your knowledge further with Interested? Explore more of what has…...
ASML: Next-generation chip machine (Hyper NA) in ten years
3+ day, 21+ hour ago (363+ words) ASML and its partner Carl Zeiss expect that a successor to the High NA EUV machine could be ready in about ten years. Engineers from both companies describe this in a peer-reviewed paper. The so-called Hyper NA machine is designed…...
[News] NVIDIA’s NVHBM Reshapes Base Die Strategies: How Micron, Samsung Are Bringing TSMC Into the Fold
3+ day, 8+ hour ago (364+ words) NVIDIA’s NVHBM, announced in August, could mark a turning point for custom HBM. By moving the memory controller into the HBM base die, the architecture gives base dies a bigger role—and is already reshaping how memory makers source them....