Back‑End Packaging & Test

13+ min ago   (219+ words) When scaling throughput on the facility floor, engineering and procurement teams routinely discover that vendor catalog ratings rarely reflect real-world floor physics: Over 65% of post-commissioning bottlenecks and warranty disputes trace back to underestimated boundary conditions at the interface between the…...

1+ hour, 15+ min ago   (175+ words) The partnership aligns with India’s efforts to establish a domestic outsourced semiconductor assembly and test (OSAT) industry Tata Electronics and Dutch semiconductor assembly equipment supplier Besi have signed a memorandum of understanding (MoU) to develop advanced semiconductor packaging capabilities in…...

1+ hour, 59+ min ago   (229+ words) Signode, a global provider of transit packaging equipment, automation, materials, and aftermarket support solutions with a presence in India, will demonstrate integrated technologies for case handling, palletizing, strapping, load containment, and material handling at Pack Expo International 2026, taking place 18–21 October…...

3+ hour, 22+ min ago   (174+ words) Markem-Imaje Preps Brands for GS1 Sunrise with CoLOS Markem-Imaje built 'CoLOS 2D Activate' and 'CoLOS 2D Engage' as SaaS systems for CPG and FMCG manufacturers, with consulting support that checks production setups and coding workflows. They help companies prepare for GS1 Sunrise 2027 while turning…...

3+ day, 11+ hour ago   (399+ words) GlobalFoundries (GF) has announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta,…...

11+ hour, 40+ min ago   (221+ words) Taiwan’s Win Semiconductors, a pure-play compound semiconductor foundry vendor, has added SawStreet LLC to its partner program. Based in Orlando, Florida, SawStreet will provide backend services for Win’s foundry customers in the United States. Meanwhile, headquartered in Taoyuan, Win Semiconductors…...

17+ hour, 58+ min ago   (484+ words) GlobalFoundries and TSMC have agreed to a multi-year manufacturing deal that brings production of a critical component for advanced AI chips to the United States. The partnership aims to address a known bottleneck in the semiconductor supply chain for high-performance…...

14+ hour, 47+ min ago   (67+ words) Birmingham-based chemical etching specialist Precision Micro has appointed seven graduates, as strong commercial growth fuels continued investment in the skills and manufacturing capabilities needed to support its expansion.The graduates will gain experience across Precision Micro’s technology, processes and customer…...

1+ day, 18+ hour ago   (172+ words) Myanmar International TV Myanmar Packaging Forum 2026: MOIMSMED UM delivered remarks via video conferencing Aiming to promote safe and environmentally friendly products and packaging systems and to facilitate access to international markets, Myanmar Packaging Forum 2026 was held at Mingalar Hall of…...

1+ day, 20+ hour ago   (230+ words) Detecting surface deviations directly inside a progressive die could help manufacturers reduce scrap and identify tool wear earlier. Fraunhofer IGD’s camera-based Inform-QC system inspects formed components at up to 400 strokes per minute without slowing production. Inform-QC can, for example, be…...