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Litho, etch, deposition, metrology, and wafer capacity additions.
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Inline Surface Inspection in Progressive Dies at 400 SPM
1+ day, 20+ hour ago (230+ words) Detecting surface deviations directly inside a progressive die could help manufacturers reduce scrap and identify tool wear earlier. Fraunhofer IGD’s camera-based Inform-QC system inspects formed components at up to 400 strokes per minute without slowing production. Inform-QC can, for example, be…...
Anton Paar launches new UNHT series for next-generation nanoindentation
2+ day, 19+ hour ago (260+ words) Anton Paar introduces the new UNHT Series, a new generation of nanoindentation systems designed to deliver reliable results, faster workflows, and greater versatility across a wide range of materials At the core of the series is a measurement concept that…...
Metrology Parts Releases "The Invisible Baseline: Why Exactness is Non-Negotiable on the Factory Floor"
4+ day, 17+ hour ago (305+ words) /PRNewswire/ -- Metrology Parts has announced the release of its latest resource, "The Invisible Baseline: Why Exactness is Non-Negotiable on the Factory Floor.... BAXTER, Minn., Oct. 7, 2026 /PRNewswire/ -- Metrology Parts has announced the release of its latest resource, "The Invisible Baseline: Why…...
Editorial Focus eBook - Semiconductor Inspection and Failure Analysis (2nd Edition)
6+ day, 14+ hour ago (186+ words) As semiconductor devices shrink and architectures grow more complex, defects are harder to spot and far more expensive to miss. This eBook looks at how inspection and failure analysis help manufacturers uncover subtle weaknesses, protect yield, and strengthen device reliability…...
METTLER TOLEDO showcases new Product Inspection Technologies at Pack Expo
5+ day, 19+ hour ago (435+ words) METTLER TOLEDO will also introduce its new M50 R-Series AdvancedLine metal detectors to North America at the show, where an M56 on an SL2000 conveyor and an M55 GC will be on display. The series combines AI-based machine learning, automated performance monitoring and a…...
ZEISS on how powder data, in-process scanning and AI are converging to solve AM's biggest QC bottleneck
6+ day, 14+ hour ago (919+ words) TCT speaks to Paul Brackman, X-ray Product Manager for ZEISS Research & Quality Solutions USA, about how ZEISS is supporting next-generation quality control and defect inspections within additive manufacturing. Among its range of other business focuses, ZEISS is among the leading…...
LK Metrology integrates Revo 5-axis probe with latest software - MM Media
1+ week, 17+ hour ago (78+ words) LK Metrology proprietary CAMIO software for programming, analysis and reporting on coordinate measuring machines (CMM) has had a major update. The latest CAMIO 2026 R1 version advances multi-sensor metrology with comprehensive support for Renishaw’s REVO 5-axis scanning probe system.The development enables manufacturers…...
Manufacturing's Slow Speed Dilemma; More Lean Myths Debunked: IndustryWeek's Weekly Review
1+ week, 2+ day ago (325+ words) Register now for IW's Operations Leadership Summit (OLS), Oct. 20-22! A wide breadth of topics captured the attention of our IndustryWeek manufacturing audience in this issue of IW's Weekly Review, which shares the most-consumed content over the past seven days. From…...
Cognex Launched an AI-Powered Wafer Reader for Semiconductor Fabs
1+ week, 4+ day ago (339+ words) By Sachin Mohan · AIM Media House As semiconductor manufacturers scale capacity to meet AI infrastructure demand, wafer identification is emerging as a production bottleneck. Degraded marks, varied substrate materials, and non-standard fonts create read failures that trigger manual intervention and…...
Advanced Inspection Made Accessible – Interactive Webinar
1+ week, 6+ day ago (418+ words) Evident’s new NORTEC™ 700 portable eddy current and eddy current array (ECA) flaw detector. Image Credit: Evident Conventional eddy current testing (ECT) covers a narrow strip per pass, and every result depends on reading an impedance plane signal correctly. Eddy current…...